HOZAN HS-304 Flux cored Solder Wire Lead Free (Sn 96.5/ Ag 3.0/ Cu 0.5)-with 3% Silver (SAC305) 1.0mm- 100g from Japan

 

 

Flux cored Solder Wire Lead Free (Sn 96.5/ Ag 3.0/ Cu 0.5)-with 3% Silver

HOZAN (SAC305) HS-304 1.0mm- 100g

SKU= HOZAN-HS-304

 The HOZAN HS-304 Flux-Cored Lead-Free Solder Wire is a highly reliable, professional-grade soldering consumable manufactured by the Japanese precision tool brand Hozan. 1.00mm in 100g spool SAC305 Lead-free solder wire It utilizes the SAC305 alloy, which is globally recognized as the industry standard composition for eco-friendly, high-performance electronics manufacturing and circuit board repair. Key Technical SpecificationsAlloy Composition: 96.5% Tin (Sn), 3.0% Silver (Ag), and 0.5% Copper (Cu). Melting Point: 217°C to 220°C (Requires higher iron temperatures, typically 350°C to 370°C, compared to traditional 60/40 leaded solder). Flux Type: Pre-loaded with an internal MIL-RMA grade rosin flux core, ensuring fast surface wetting, minimal spattering, and dependable joints. Distributed in a 1.0mm wire diameter and standard 100g spools under the specific part designation HS-304

 

 HOZAN HS-304 Lead-Free Solder 1.0mm/100g

 ◆Manufacturer: HOZAN
◆Product name: Lead-free solder 1.0mm/100g (HS304)
◆Product number: HS-304
◆Sn (tin)-Ag (silver) type solder is a lead-free solder that is less prone to corrosion and seizing when using corrosion-resistant bits.
◆Soldering of precision electronic equipment.
◆Wire diameter (mm): 1.0
◆Lead-free solder compatible: Yes
◆Melting point: 217-220℃
◆Flux: JIS A class
◆Alloy composition (tin: 96.5%, silver: 3.0%, copper: 0.5%)
◆Country of origin: Japan

 

 

 

Flux cored Solder Wire Lead Free (Sn 96.5/ Ag 3.0/ Cu 0.5)-with 3% Silver HOZAN HS-302 0.6mm- 100g SAC305

Flux cored Solder Wire Lead Free (Sn 96.5/ Ag 3.0/ Cu 0.5)-with 3% Silver

HOZAN (SAC305) HS-302 0.6mm-100g

SKU= HOZAN-HS-302

 

 

HOZAN HS-302 is a premium, Japanese-manufactured lead-free solder wire widely utilized for high-reliability electronics assembly and precision repair work.Key SpecificationsAccording to official technical data from HOZAN CO., LTD., the wire features the following properties:Alloy Composition: Sn-3Ag-0.5Cu (96.5% Tin, 3% Silver, 0.5% Copper). This is standard SAC305 alloy. Wire Diameter: 0.6 mm (0.02 inches). Melting Point: 217°C to 220°C (Solid-phase to liquid-phase).Flux Type: Core flux meets MIL-RMA grade specifications. Bobbin Weight: 100 grams. Total Length: Approximately 56 meters per roll. Anti-Static Compliance: ESD control value yields an electrical resistance of less than 1 x 10¹² Ω. Key Performance Benefits

High Conductivity: The 3% silver composition yields excellent joint strength, high electrical conductivity, and dependable structural durability compared to silver-free variations. Reduced Spattering: Formulated with a specialized low-splatter flux core to ensure tidy work spaces and clean PCB surface environments.Fine Pitch Suitability: The ultra-thin 0.6 mm diameter provides excellent accuracy for soldering fine-pitch surface-mount devices (SMD) and micro-electronics.

 

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