Chem-Wik® Rosin SD ( made in USA)
The fast, safe rosin flux desoldering braid packaged in static dissipative bobbins, ITS HALIDE FREE
■ Reduces the risk of damage associated with static electricity
■ Coated with noncorrosive ultra high purity Type R rosin flux
■ Quickly and thoroughly removes solder
Static Dissipative Packaging
■ DOD Standard 1686C and MIL-HDBK-263B
■ Mil-Std-2000A
■ Mil-B-81705C Static Decay Rate Provision
PermaPak™ Barrier Packaging contains 25 bobbins per package
Wick Size #1 White/Gray
0.03" / 0.8mm wide - best for SMD and micro-circuits| 2-5L | 5' / 1.5m L, ESD-safe bobbin |
25 bobbins/case |
Wick Size #2 Yellow
0.06" / 1.5mm wide - best for small pads and SMD| 5-5L | 5' / 1.5m L, ESD-safe bobbin |
2 5 bobbins/case |
Wick Size #3 Green
0.08" / 1.9mm (2mm) - best for medium pads| 7-5L | 5' / 1.5m L, ESD-safe bobbin |
25 bobbins/case |
Wick Size #4 Blue
0.110" / 2.8mm - best for large pads| 10-5L |
5' / 1.5m L, ESD-safe bobbin |
25 bobbins/case |
NOTES:
1. ALL sizes are available now-
2-5L - equivalent of size #1
5-5L- equivalent of size # 2
Green (7-5L)- 1.9mmx 1.5m ( equivalent of size #3)
How are Soder-Wick and Chem-Wik desoldering braid products classified?
Chemtronics uses 2 types of flux: Soder-Wick and Chem-Wik lines use natural gum rosin. Per J-STD-004 Section 3.2, they are classified as ROL0. Per British Std. EN 29454-1:1993 and ISO9454-1:1990, they have a classification of 1.1.1.B. No-Clean and Lead-Free fluxes are synthetic (non-colophony)flux. Per J-STD-004 Section 3.2, they are classified as REL0. Per British Std. EN 29454-1:1993 and ISO9454-1:1990, the No-Clean and Lead-Free fluxes have a classification of 1.2.3.B.
What is desoldering wick made of?
Desoldering braid (wick) is made of fine strands of ultra-pure copper woven and coated with flux. Its geometrically precise weave design allows for maximum capillary action and solder capacity. Soder-wick optimizes heat transfer through the braid and into the solder joint, resulting in faster wicking action than any other competitive brand. Minimal flux residue on the board speeds up the cleaning process or eliminates it entirely.
